Title:
COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/202539
Kind Code:
A1
Abstract:
Provided is a copper foil with a carrier, with which excellent laser processability can be achieved. This copper foil with a carrier is provided with a carrier, a release layer, and an ultrathin copper foil in said order, wherein copper crystal grains that are present on the release-layer-side surface of the ultrathin copper foil have a plane size S1 of 50 nm to 600 nm as measured using an electron backscatter diffraction (EBSD) method.
More Like This:
| WO/1999/011842 | PROCESS FOR MAKING COPPER WIRE |
| JP2012107266 | METHOD AND APPARATUS FOR MANUFACTURING ELECTROLYTIC COPPER FOIL |
| JP3768104 | FLEXIBLE PRINTED BOARD |
Inventors:
HOSOKAWA MAKOTO (JP)
HIRAOKA SHINYA (JP)
MIZOGUCHI MISATO (JP)
KANEKO TETSUYA (JP)
NAKAJIMA DAISUKE (JP)
MATSUDA MITSUYOSHI (JP)
HIRAOKA SHINYA (JP)
MIZOGUCHI MISATO (JP)
KANEKO TETSUYA (JP)
NAKAJIMA DAISUKE (JP)
MATSUDA MITSUYOSHI (JP)
Application Number:
PCT/JP2022/011923
Publication Date:
September 29, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D1/04; B32B15/08; B32B15/20; C25D5/12; C25D5/14; C25D5/16; C25D7/06; H05K1/09
Foreign References:
| JP2014198884A | 2014-10-23 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Download PDF: