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Title:
ROUGHENED COPPER FOIL, COPPER FOIL EQUIPPED WITH CARRIER, COPPER-CLADDED LAMINATE BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/202540
Kind Code:
A1
Abstract:
Provided is a roughened copper foil capable of achieving both high adhesiveness with respect to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. In the roughened surface, the surface texture aspect ratio Str is 0.02-0.24, and the load area ratio Smr1 separating protruding peaks from a core portion is 1.0-15.0%. Str and Smr1 are values measured in compliance with ISO 25178 at a cutoff wavelength of 0.251 μm using an S-filter and at a cutoff wavelength of 4.5 μm using an L-filter.

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Inventors:
NAKAJIMA DAISUKE (JP)
SATO YASUO (JP)
Application Number:
PCT/JP2022/011924
Publication Date:
September 29, 2022
Filing Date:
March 16, 2022
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D1/04; B32B15/04; C25D5/12; C25D5/16; C25D7/06; H05K1/09; H05K3/38
Domestic Patent References:
WO2017179416A12017-10-19
WO2018110579A12018-06-21
WO2015040998A12015-03-26
WO2014126193A12014-08-21
Foreign References:
JP2020122189A2020-08-13
JP2018172782A2018-11-08
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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