COPPER PASTE FOR FORMING SINTERED COPPER PILLAR AND METHOD FOR PRODUCING BONDED BODY

Title:

COPPER PASTE FOR FORMING SINTERED COPPER PILLAR AND METHOD FOR PRODUCING BONDED BODY

Document Type and Number:

WIPO Patent Application WO/2021/060204

Kind Code:

A1

Abstract:

A copper paste for forming a sintered copper pillar that bonds members to each other, said copper paste containing metal particles and an organic dispersion medium. With respect to this copper paste for forming a sintered copper pillar, the metal particles contain copper particles; and the organic dispersion medium contains a high-boiling-point solvent, which has a boiling point of 280°C or higher, in an amount of from 50% by mass to 99% by mass based on the total mass of the organic dispersion medium.

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Inventors:

YANAKA YUICHI (JP)
NAKAKO HIDEO (JP)
KAWANA YUKI (JP)
NEGISHI MOTOHIRO (JP)
SUGAMA CHIE (JP)
EJIRI YOSHINORI (JP)

Application Number:

PCT/JP2020/035564

Publication Date:

April 01, 2021

Filing Date:

September 18, 2020

Export Citation:

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Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

B22F1/00; B22F7/08; B82Y30/00; B82Y40/00; H01B1/22

Domestic Patent References:

WO2019093427A1

2019-05-16

Foreign References:

JP2003110240A	2003-04-11
JP2016115846A	2016-06-23
US20160351529A1	2016-12-01

Other References: