Title:
COPPER PASTE, WICK FORMATION METHOD AND HEAT PIPE
Document Type and Number:
WIPO Patent Application WO/2021/206098
Kind Code:
A1
Abstract:
A copper paste for forming wick of a heat pipe, the copper paste containing copper particles, a thermally decomposable resin and a dispersion medium, the copper particles including a copper particle of a larger diameter having a volume-average particle diameter of 10-50 μm and a copper particle of a smaller diameter having a volume-average particle diameter of 0.1-2.0 μm.
Inventors:
NAKAKO HIDEO (JP)
EJIRI YOSHINORI (JP)
ISHIKAWA DAI (JP)
NATORI MICHIKO (JP)
NEGISHI MOTOHIRO (JP)
EJIRI YOSHINORI (JP)
ISHIKAWA DAI (JP)
NATORI MICHIKO (JP)
NEGISHI MOTOHIRO (JP)
Application Number:
PCT/JP2021/014659
Publication Date:
October 14, 2021
Filing Date:
April 06, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B22F1/00; B22F7/04; B22F9/00; F28D15/02; F28D15/04
Domestic Patent References:
| WO2018131095A1 | 2018-07-19 |
Foreign References:
| JP2003222481A | 2003-08-08 | |||
| JP2017123326A | 2017-07-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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