Title:
CORELESS BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/107060
Kind Code:
A1
Abstract:
Provided is a coreless board manufacturing method. The method comprises: providing a supporting carrier; laminating inner copper foil layers on an upper accumulation layer of the supporting carrier, disposing inner prepregs between the inner copper foil layers, and disposing outer copper foil layers outside outer prepregs to manufacture a coreless board, the highest temperature for laminating the inner copper foil layers and the inner prepregs ranging from 140ºC to 180ºC; and separating the coreless board from the supporting carrier. In the coreless board manufacturing method, in a laminating process, pre-lamination is used for the inner prepregs and the inner copper foil layers, full-lamination is used for outer layers, the laminating temperature and the laminating time are both improved, the residual stress on the inner prepregs is lowered, and the buckling of the coreless board is reduced.
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Inventors:
XIE TIANHUA (CN)
LI ZHIDONG (CN)
ZHANG ZHIQIANG (CN)
LI ZHIDONG (CN)
ZHANG ZHIQIANG (CN)
Application Number:
PCT/CN2015/080253
Publication Date:
July 07, 2016
Filing Date:
May 29, 2015
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
International Classes:
H01L21/58; H05K3/42; H05K3/46
Foreign References:
| CN104582329A | 2015-04-29 | |||
| CN104538320A | 2015-04-22 | |||
| CN104540339A | 2015-04-22 | |||
| CN104540326A | 2015-04-22 | |||
| CN101142864A | 2008-03-12 | |||
| CN102686053A | 2012-09-19 | |||
| CN103987198A | 2014-08-13 | |||
| US20040253473A1 | 2004-12-16 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
广州华进联合专利商标代理有限公司 (CN)
广州华进联合专利商标代理有限公司 (CN)
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