Title:
COUPLER AND RELATED METHOD, MODULE AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/070271
Kind Code:
A1
Abstract:
Embodiments of the present disclosure relate to a coupler, antenna module and electronic device. The coupler comprises a first substrate layer and a second substrate layer located below the first substrate layer. The coupler also comprises a first coupling line located on an upper surface of the first substrate layer and a second coupling line located on a lower surface of the second substrate layer. The coupler further comprises a first ground layer located between a lower surface of the first substrate layer and an upper surface of the second substrate layer, a plurality of hole groups being formed in the first ground layer and being geometrically designed such that an electromagnetic field of the first coupling line is coupled to the second coupling line through the plurality of hole groups. In this way, PCB space and size may be saved, RF performance may be improved, and PCB cost may be reduced.
Inventors:
WANG YUANHAO (CN)
WANG HAO (CN)
MIAO LI (CN)
LI CHENG (CN)
ZHOU FENG (CN)
WANG HAO (CN)
MIAO LI (CN)
LI CHENG (CN)
ZHOU FENG (CN)
Application Number:
PCT/CN2021/126143
Publication Date:
May 04, 2023
Filing Date:
October 25, 2021
Export Citation:
Assignee:
NOKIA SHANGHAI BELL CO LTD (CN)
NOKIA SOLUTIONS & NETWORKS OY (FI)
NOKIA SOLUTIONS & NETWORKS OY (FI)
International Classes:
H01P5/12; H01P1/203
Foreign References:
| JP2007243123A | 2007-09-20 | |||
| CN103187603A | 2013-07-03 | |||
| CN113049883A | 2021-06-29 | |||
| CN105591183A | 2016-05-18 |
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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