Title:
WAFER BONDING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/070272
Kind Code:
A1
Abstract:
Embodiments of the present application provide a wafer bonding device and method. The wafer bonding method comprises: determining a first position parameter of a first alignment mark on a first wafer by using a transmissive light beam; determining a second position parameter of a second alignment mark on a second wafer by using the transmissive light beam, wherein the transmissive light beam penetrates through the first wafer and/or the second wafer; according to the first position parameter and the second position parameter, adjusting the relative position of the first wafer and the second wafer by using the transmissive light beam, so that the relative position of the first alignment mark and the second alignment mark satisfies a predetermined bonding condition; and bonding the first wafer to the second wafer.
Inventors:
CHEN GUOLIANG (CN)
LIU MENGYONG (CN)
LIU YANG (CN)
LIU WU (CN)
LIU MENGYONG (CN)
LIU YANG (CN)
LIU WU (CN)
Application Number:
PCT/CN2021/126160
Publication Date:
May 04, 2023
Filing Date:
October 25, 2021
Export Citation:
Assignee:
YANGTZE MEMORY TECH CO LTD (CN)
International Classes:
H01L21/68
Foreign References:
| CN111584415A | 2020-08-25 | |||
| CN109904105A | 2019-06-18 | |||
| JP2000012445A | 2000-01-14 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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