Title:
COVER GLASS FOR LIGHT EMITTING DIODE PACKAGES, SEALED STRUCTURE AND LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/087812
Kind Code:
A1
Abstract:
Provided are: a cover glass for light emitting diode packages, which is capable of suppressing deterioration of the transmittance characteristics over a long period of use; and a light emitting device.
A cover glass for light emitting diode packages, which has a basic composition containing, in mass% in terms of oxides, 55-80% of SiO2, 0.5-15% of Al2O3, 5-25% of B2O3, 0-7% of Li2O, 0-15% of Na2O, 0-10% of K2O, 0-0.1% of SnO2 and 0.001-0.1% of Fe2O3 (provided that Li2O + Na2O + K2O is 2-20%). This cover glass for light emitting diode packages does not substantially contain As2O3, Sb2O3 and PbO, and has an average thermal expansion coefficient of 45-70 × 10-7/°C over the temperature range of 0-300°C.
Inventors:
SHIRATORI MAKOTO (JP)
MITSUI YOKO (JP)
TAKEDA SATOSHI (JP)
MITSUI YOKO (JP)
TAKEDA SATOSHI (JP)
Application Number:
PCT/JP2014/082305
Publication Date:
June 18, 2015
Filing Date:
December 05, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03C3/091; H01L33/48
Domestic Patent References:
| WO2006103942A1 | 2006-10-05 |
Foreign References:
| JP2003095692A | 2003-04-03 | |||
| JP2006265068A | 2006-10-05 | |||
| JP2008019134A | 2008-01-31 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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