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Patent Searching and Data


Title:
POWDER PRIMER COMPOSITION AND LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/087813
Kind Code:
A1
Abstract:
To provide: a powder primer composition having excellent adhesiveness; and a laminate which is obtained using the powder primer composition. A powder primer composition which contains: a powder that is formed of a reactive ethylene/tetrafluoroethylene copolymer which contains a repeating unit (A) based on tetrafluoroethylene, a repeating unit (B) based on ethylene and a repeating unit (C) based on a monomer having an acid anhydride residue and a polymerizable unsaturated bond, with the molar ratio (C)/((A) + (B)) being from 1/10,000 to 5/100; and a powder that is formed of an epoxy resin which has an epoxy equivalent weight of 500-2,700 and a softening point of 70°C or more. The mass ratio of the powder formed of a reactive ethylene/tetrafluoroethylene copolymer relative to the powder formed of an epoxy resin is from 99/1 to 80/20.

Inventors:
HOSHIKAWA JUN (JP)
TATE NORIHARU (JP)
SUSA HITOSHI (JP)
Application Number:
PCT/JP2014/082312
Publication Date:
June 18, 2015
Filing Date:
December 05, 2014
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C09D127/18; B32B27/30; C09D5/00; C09D5/03; C09D123/08; C09D127/12; C09D163/00
Domestic Patent References:
WO2002090450A12002-11-14
Foreign References:
JPS58141252A1983-08-22
JP2006206637A2006-08-10
JP2007314759A2007-12-06
JP2006206637A2006-08-10
JP2006167689A2006-06-29
US3111426A1963-11-19
JP2004238405A2004-08-26
Other References:
See also references of EP 3081608A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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