Title:
COVER FOR STRUCTURAL COMPONENT OF POLISHING DEVICE, STRUCTURAL COMPONENT OF POLISHING DEVICE, AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/152052
Kind Code:
A1
Abstract:
Provided is a cover to which a polishing solution does not readily adhere. A cover for a structural component of a polishing device for polishing a substrate is provided with a locking mechanism for locking a main body of the structural component to the cover, the locking mechanism being provided inside the cover. The outer surface of the cover, which is exposed to the outside, has no recesses, and has no flat surfaces with the exception of the top portion of the cover.
Inventors:
SHINKAI KENJI (JP)
SONE TADAKAZU (JP)
AIZAWA HIDEO (JP)
AONO HIROSHI (JP)
SONE TADAKAZU (JP)
AIZAWA HIDEO (JP)
AONO HIROSHI (JP)
Application Number:
PCT/JP2015/059631
Publication Date:
October 08, 2015
Filing Date:
March 27, 2015
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B55/06; B23Q11/08; H01L21/304
Foreign References:
| JP2013141735A | 2013-07-22 | |||
| JP2007168039A | 2007-07-05 | |||
| JP2002058543A | 2002-02-26 | |||
| JP2004356517A | 2004-12-16 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
Ono Shinjiro (JP)
Ono Shinjiro (JP)
Download PDF: