Title:
RESIN COMPOSITION FOR ORGANIC ELECTRONIC DEVICE ELEMENT ENCAPSULATION, RESIN SHEET FOR ORGANIC ELECTRONIC DEVICE ELEMENT ENCAPSULATION, ORGANIC ELECTROLUMINESCENT ELEMENT AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/152053
Kind Code:
A1
Abstract:
A resin composition for organic electronic device element encapsulation, which is characterized by containing (A) a polyisobutylene resin, (B) a hydrogenated cyclic olefin resin and (C) a polymer which is obtained by means of radical polymerization, anionic polymerization or coordination polymerization and has rubber elasticity; a resin sheet which is obtained using this resin composition for organic electronic device element encapsulation; an organic electroluminescent element; and an image display device.
Inventors:
MIEDA TETSUYA (JP)
ISHIGURO KUNIHIKO (JP)
ISHIGURO KUNIHIKO (JP)
Application Number:
PCT/JP2015/059634
Publication Date:
October 08, 2015
Filing Date:
March 27, 2015
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H05B33/04; C08L21/00; C08L23/22; C08L45/00; G09F9/30; H01L27/32; H01L51/50
Domestic Patent References:
| WO2014069398A1 | 2014-05-08 |
Foreign References:
| JP2009524705A | 2009-07-02 | |||
| JP2010080293A | 2010-04-08 | |||
| JP2010500434A | 2010-01-07 | |||
| JP5435520B1 | 2014-03-05 | |||
| JP2010080289A | 2010-04-08 | |||
| JP2011231313A | 2011-11-17 | |||
| JP2012193335A | 2012-10-11 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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