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Title:
CRIMPING TERMINAL, TERMINAL-EQUIPPED ELECTRIC WIRE WITH THE CRIMPING TERMINAL, AND METHOD OF MANUFACTURING THE TERMINAL-EQUIPPED ELECTRIC WIRE
Document Type and Number:
WIPO Patent Application WO/2010/001851
Kind Code:
A1
Abstract:
A crimping terminal (10) crimped to an end of an electric wire (20) to form a terminal-equipped electric wire, wherein the terminal-equipped electric wire achieves at the same time sufficient mechanical strength and reduced contact resistance between the electric wire (20) and the terminal.  The crimping terminal (10) has an electrically connecting section (12) and an electric wire crimping section (14) crimped to a conductor (22) of the end of the electric wire (20), and the crimping terminal (10) is constructed from a metal plate having a body section containing copper and also having a tin plating layer covering the surface of the body section.  The crimping terminal (10) is configured such that the thickness of the tin plating layer of that crimping surface of the electric wire crimping section (14) at which the electric wire crimping section (14) makes contact with the end of the electric wire is less than the thickness of the tin plating layer of that electric contact surface of the electric contact section (12) at which the electric contact section (12) makes contact with a mating terminal.

Inventors:
ONO JUNICHI (JP)
HIRAI HIROKI (JP)
TANAKA TETSUJI (JP)
SHIMODA HIROKI (JP)
OTSUKA TAKUJI (JP)
Application Number:
PCT/JP2009/061839
Publication Date:
January 07, 2010
Filing Date:
June 29, 2009
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
ONO JUNICHI (JP)
HIRAI HIROKI (JP)
TANAKA TETSUJI (JP)
SHIMODA HIROKI (JP)
OTSUKA TAKUJI (JP)
International Classes:
H01R13/03; H01R4/18; H01R43/048; H01R43/16
Domestic Patent References:
WO2009081799A12009-07-02
Foreign References:
JP2009152052A2009-07-09
JPH10134869A1998-05-22
JPS63121693A1988-05-25
JPH11214050A1999-08-06
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
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