Title:
Cu-Al-Mn-BASED ALLOY MATERIAL, METHOD FOR PRODUCING SAME, AND ROD-LIKE OR SHEET-LIKE MATERIAL USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/137283
Kind Code:
A1
Abstract:
Provided, as a Cu-Al-Mn-based alloy material having excellent resistance to repeated deformation, is a Cu-Al-Mn-based alloy material which has a composition consisting of 3.0-10.0 mass % of Al, 5.0-20.0 mass % of Mn and specified quantities of one or more components selected from among the group consisting of Ni, Co, Fe, Ti, V, Cr, Si, Nb, Mo, W, Sn, Mg, P, Be, Sb, Cd, As, Zr, Zn, B, C, Ag and misch metal, with the remainder consisting of Cu and unavoidable impurities, and which has a long shape in a rolling direction (RD), wherein the content of crystal grains (X), in which the crystal grain length (ax) in the rolling direction of the alloy material relative to the width or diameter (R) of the alloy material is R/2 or less and the crystal grain length (bx) in a direction perpendicular to the rolling direction of the alloy material is R/4 or less, is 15% or less of the overall alloy material, and the content of crystal grains (Y'), in which the crystal grain length (a) in the rolling direction and the crystal grain length (b) in the direction perpendicular to the rolling direction are such that a ≥ b and the angle formed between the rolling direction and the normal line of the (111) face of the crystal is 15° or more, is 85% or more of the overall alloy material.
Inventors:
FUJII MISATO (JP)
KISE SUMIO (JP)
TANAKA TOYONOBU (JP)
NAKAMIZO KENJI (JP)
ISHIKAWA KOJI (JP)
OMORI TOSHIHIRO (JP)
KAINUMA RYOSUKE (JP)
KISE SUMIO (JP)
TANAKA TOYONOBU (JP)
NAKAMIZO KENJI (JP)
ISHIKAWA KOJI (JP)
OMORI TOSHIHIRO (JP)
KAINUMA RYOSUKE (JP)
Application Number:
PCT/JP2015/056856
Publication Date:
September 17, 2015
Filing Date:
March 09, 2015
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
FURUKAWA TECHNO MAT CO LTD (JP)
UNIV TOHOKU (JP)
FURUKAWA TECHNO MAT CO LTD (JP)
UNIV TOHOKU (JP)
International Classes:
C22C9/05; C22C9/01; C22F1/08; C22F1/00
Domestic Patent References:
| WO2011152009A1 | 2011-12-08 | |||
| WO2014042160A1 | 2014-03-20 | |||
| WO2015008689A1 | 2015-01-22 |
Foreign References:
| JP2003138330A | 2003-05-14 | |||
| JP2001020026A | 2001-01-23 | |||
| JP2015054977A | 2015-03-23 | |||
| JP2014218717A | 2014-11-20 |
Other References:
See also references of EP 3118338A4
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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