Title:
Cu-BASED SINTERED BEARING AND PRODUCTION METHOD FOR Cu-BASED SINTERED BEARING
Document Type and Number:
WIPO Patent Application WO/2016/035880
Kind Code:
A1
Abstract:
Provided is a Cu-based sintered bearing comprising: 15-36 mass% of Ni; 3-13 mass% of Sn; 0.05-0.55 mass% of P; and 0.02-4 mass% C in total, the balance consisting of Cu and inevitable impurities, wherein the content of C forming an alloy with a matrix within Cu-Ni main-phase grains is 0.02-0.10 mass%.
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Inventors:
ISHII YOSHINARI (JP)
TAKEZOE SHINICHI (JP)
MARUYAMA TSUNEO (JP)
TAKEZOE SHINICHI (JP)
MARUYAMA TSUNEO (JP)
Application Number:
PCT/JP2015/075180
Publication Date:
March 10, 2016
Filing Date:
September 04, 2015
Export Citation:
Assignee:
DIAMET CORP (JP)
International Classes:
C22C9/06; B22F1/12; B22F5/00; C22C1/04; C22C1/05; F16C33/10; F16C33/12; F16C33/14
Domestic Patent References:
| WO2006022337A1 | 2006-03-02 | |||
| WO2006077826A1 | 2006-07-27 | |||
| WO2012063785A1 | 2012-05-18 | |||
| WO2011024941A2 | 2011-03-03 | |||
| WO2008001789A1 | 2008-01-03 |
Foreign References:
| JP2013023707A | 2013-02-04 | |||
| JPS62133027A | 1987-06-16 | |||
| JP2006090482A | 2006-04-06 |
Other References:
See also references of EP 3190197A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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