Title:
CURABLE ADHESIVE SHEET, AND METHOD FOR PRODUCING CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/054677
Kind Code:
A1
Abstract:
Provided is a curable adhesive sheet having a curable adhesive layer capable of forming a cured product having a loss tangent of 0.01 or less at 23°C and 1 GHz, and a first release film and a second release film enclosing the two surfaces of the curable adhesive layer, wherein the first release film has a colored resin film (i) and a release agent layer that is laminated on one surface of the colored resin film (i) and is in contact with the surface of the curable adhesive layer, the second release film has a resin film (ii) that is visually distinguishable from the colored resin film (i) and a release agent layer that is laminated on one surface of the resin film (ii) and is in contact with the surface of the curable adhesive layer, and the curable adhesive sheet satisfies requirement (Ia). Requirement (Ia): the thickness ratio [(T2)/(T1)] of the thickness (T2) of the second release film and the thickness (T1) of the first release film is 1.05 or greater.
Inventors:
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
IZUMI NAOFUMI (JP)
KASHIO MIKIHIRO (JP)
IZUMI NAOFUMI (JP)
Application Number:
PCT/JP2022/036717
Publication Date:
April 06, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J123/26; C09J7/35; C09J7/40; C09J171/00
Domestic Patent References:
| WO2019240261A1 | 2019-12-19 |
Foreign References:
| JP2019176146A | 2019-10-10 | |||
| JP2018168234A | 2018-11-01 | |||
| JP2013067743A | 2013-04-18 | |||
| JP2011021109A | 2011-02-03 | |||
| JP2019135280A | 2019-08-15 | |||
| JP2019131680A | 2019-08-08 | |||
| CN212076918U | 2020-12-04 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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