CURABLE COMPOSITION AND ARTICLE PRODUCED BY CURING SAME

WIPO Patent Application WO/2012/020659

A1

Disclosed is a curable composition that exhibits a low viscosity before curing, rapidly cures upon heating, and can form a cured resin that has a low Abbe number of 30 or less, is highly transparent and heat-resistant, and is resistant to yellowing even under high-temperature conditions, such as reflow soldering. Also disclosed are: the cured resin obtained by curing the aforementioned curable composition; and an optical member comprising said cured resin. The disclosed curable resin composition is characterized by containing the belowmentioned components (A and B) in a weight ratio (A:B) between 70:30 and 99:1 and also containing a thiol compound. Component A is a compound that contains a fluorene ring and two (meth)acryloyloxy groups per molecule, and component B is a compound that does not contain a fluorene ring and contains at least one vinyl group or (meth)acryloyloxy group per molecule.

JP2671267	[Title of Invention] A flame-retardant polymer composition and its application to an electric cable coating.
JP2649559	[Title of Invention] Non-aqueous dispersion type resin composition

KUBO TAKASHI (JP)
FUJIKAWA TAKESHI (JP)

PCT/JP2011/067596

February 16, 2012

August 01, 2011

Click for automatic bibliography generation  

DAICEL CHEM (JP)
KUBO TAKASHI (JP)
FUJIKAWA TAKESHI (JP)

C08L33/04; C08F220/20; C08K5/37

WO2011102286A1

2011-08-25

JP2010254732A	2010-11-11
JP2010248358A	2010-11-04
JP2011126991A	2011-06-30
JP2005187661A	2005-07-14
JPH072939A	1995-01-06
JPH04325508A	1992-11-13
JP2010037470A	2010-02-18
JP2002097224A	2002-04-02
JP2009185272A	2009-08-20
JPH0912773A	1997-01-14

GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)

View/Download PDF      PDF Help

Previous Patent: METHOD FOR WINDING ELECTRODE

Next Patent: FRICTION MATERIAL COMPOSITION, AND FRICTION MATERIAL AND FRICTION MEMBER USING SAME