Title:
CURABLE COMPOSITION, CURED OBJECT, OVERCOAT FILM, AND FLEXIBLE WIRING BOARD AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/005913
Kind Code:
A1
Abstract:
Provided is a curable composition highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. The curable composition is for use in producing a flexible wiring board from a flexible substrate having wiring formed thereon, by coating the wiring-including surface portions of the flexible substrate with an overcoat film, the overcoat film being formed by curing the curable composition. The cured object obtained from this curable composition has a tensile modulus of 600-2,000 MPa and a tensile yield strength of 17 MPa or greater.
Inventors:
OOGA KAZUHIKO (JP)
ISHIBASHI YOSHITAKA (JP)
YAMAMOTO RYUNOSUKE (JP)
ISHIBASHI YOSHITAKA (JP)
YAMAMOTO RYUNOSUKE (JP)
Application Number:
PCT/JP2020/021411
Publication Date:
January 14, 2021
Filing Date:
May 29, 2020
Export Citation:
Assignee:
NIPPON POLYTECH CORP (JP)
International Classes:
C08G59/40; B32B15/092; C08K3/013; C08L63/00; H05K3/28
Domestic Patent References:
| WO2017170795A1 | 2017-10-05 | |||
| WO2011096295A1 | 2011-08-11 |
Foreign References:
| JP2007131833A | 2007-05-31 |
Attorney, Agent or Firm:
SAKAMOTO & PARTNERS (JP)
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