Title:
CURED OBJECT, OVERCOAT FILM, AND FLEXIBLE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/005914
Kind Code:
A1
Abstract:
Provided is a cured object highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. When examined by a pulse nuclear magnetic resonance method at a frequency of 20 MHz, the cured object formed from a curable resin composition gives a magnetization-intensity free induction decay signal f(t), which is for determining the spin-spin relaxation time T2 of a proton, and when the free induction decay signal f(t) is approximated by the following numerical expression, then the value of [A(1)×T2(1)+A(2)×T2(2)] calculated from the A(1), A(2), T2(1), and T2(2) contained in the numerical expression is 0.015 ms or less and the value of T2(3) is 0.50 ms or greater.
More Like This:
Inventors:
ISHIBASHI YOSHITAKA (JP)
MESUDA KOYUKI (JP)
YAMASHITA MIO (JP)
KIMURA KAZUYA (JP)
MESUDA KOYUKI (JP)
YAMASHITA MIO (JP)
KIMURA KAZUYA (JP)
Application Number:
PCT/JP2020/021412
Publication Date:
January 14, 2021
Filing Date:
May 29, 2020
Export Citation:
Assignee:
NIPPON POLYTECH CORP (JP)
International Classes:
C08G59/40; B32B15/092; B32B15/095; C08G18/08; C08G18/42; C08G18/44; C08K3/013; C08L63/00; C08L75/04; C08L101/12; H05K3/28
Domestic Patent References:
WO2017110591A1 | 2017-06-29 | |||
WO2017110326A1 | 2017-06-29 | |||
WO2016017797A1 | 2016-02-04 |
Attorney, Agent or Firm:
SAKAMOTO & PARTNERS et al. (JP)
Download PDF: