Title:
CURABLE COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/132214
Kind Code:
A1
Abstract:
Provided are a low-resistance curable composition having excellent elongation and breaking strength, and the use of the curable composition. A curable composition according to one embodiment of the present invention contains a component (A) that is a polymer having crosslinkable functional groups at or near the ends, a component (B) that is an ionic liquid having crosslinkable functional groups, and a component (C) that is a curing catalyst or an initiator.
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Inventors:
TAMAI HITOSHI (JP)
TANAKA HIDENORI (JP)
TANAKA HIDENORI (JP)
Application Number:
PCT/JP2022/046642
Publication Date:
July 13, 2023
Filing Date:
December 19, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08F290/04; C08G77/00; C08L83/04; H01B1/06
Domestic Patent References:
| WO2018048479A1 | 2018-03-15 |
Foreign References:
| JP2016062895A | 2016-04-25 | |||
| JP2018178078A | 2018-11-15 | |||
| JP2013506008A | 2013-02-21 | |||
| JP2007204682A | 2007-08-16 | |||
| US20190106579A1 | 2019-04-11 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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