CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION

WIPO Patent Application WO/2011/111667

A1

Disclosed is a curable composition that includes (A) a silane compound copolymer having specific repeating units, (B) an epoxy compound having an isocyanurate skeleton, (C) a curing agent that includes an alicyclic acid anhydride having a carboxyl group, and (D) a silane coupling agent having an acid anhydride structure. Also disclosed are a hardened material formed by hardening the composition and a method for using the aforementioned composition as an adhesive for an optical element fixing material and as a sealing material for an optical element fixing material. With the curable composition, a hardened material can be obtained that does not lose transparency with coloring and has excellent transparency over an extended period of time even when irradiated with high-energy light or when in a high temperature state, and that has high adhesive strength even at high temperatures. The curable composition can be used when forming an optical element fixing material, and in particular can be optimally used as an adhesive for an optical element fixing material and as a sealing material for an optical element fixing material.

KASHIO MIKIHIRO (JP)

PCT/JP2011/055273

September 15, 2011

March 07, 2011

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LINTEC CORP (JP)
KASHIO MIKIHIRO (JP)

C08L83/04; C08G59/42; C08K5/12; C08K5/541; C08L63/06; C09J163/06; C09J183/04; H01L21/52; H01L23/29; H01L23/31; H01L33/56; C08G77/04

WO2009104505A1	2009-08-27
WO2009101753A1	2009-08-20
WO2009119634A1	2009-10-01
WO2008102259A2	2008-08-28

JP2009030013A	2009-02-12
JP2008116904A	2008-05-22
JP2008088415A	2008-04-17
JP2008266585A	2008-11-06

OHISHI HARUHITO (JP)
Haruhito Oishi (JP)

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