Title:
CURABLE COMPOSITION, AND RESIN COMPOSITION FOR STEREOLITHOGRAPHY PREPARED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2020/262565
Kind Code:
A1
Abstract:
Provided are: a curable composition which has low viscosity and excellent curability and is thus easily molded when molded by stereolithography, and from which a cured product having excellent toughness and water resistance can be obtained; and a resin composition for stereolithography which is prepared therefrom. In addition, provided is a resin composition for stereolithography which is particularly suitable for a dental mouthpiece and a denture base material. This curable composition contains 79.0-99.0 mass% of a polymerizable monomer (a), 0.1-10.0 mass% of a photopolymerization initiator (b), and 0.01-20.0 mass of a compound represented by general formula (I).
Inventors:
SUZUKI KENJI (JP)
NISHIJIMA YUKI (JP)
NOGUCHI DAIKI (JP)
FUKUMOTO TAKASHI (JP)
NISHIJIMA YUKI (JP)
NOGUCHI DAIKI (JP)
FUKUMOTO TAKASHI (JP)
Application Number:
PCT/JP2020/025112
Publication Date:
December 30, 2020
Filing Date:
June 25, 2020
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08F20/40; B29C64/135; B29C64/314; C08F290/06
Domestic Patent References:
| WO2019107252A1 | 2019-06-06 | |||
| WO2012042911A1 | 2012-04-05 |
Foreign References:
| JP2015010168A | 2015-01-19 | |||
| JP2000159621A | 2000-06-13 |
Other References:
See also references of EP 3992216A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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