Title:
CURABLE COMPOSITION AND STEREOLITHOGRAPHIC RESIN COMPOSITION COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2020/262564
Kind Code:
A1
Abstract:
Provided is a curable composition that, when used for molding by stereolithography, facilitates molding due to a low viscosity and excellent curability, and that yields a cured product having an excellent toughness and water resistance. Also provided is a stereolithographic resin composition comprising this curable composition. Also provided in particular is a stereolithographic resin composition suitable for dental mouthpieces and denture base materials. The curable composition comprises 79.0-99.0 mass% of a polymerizable monomer (a), 0.1-10.0 mass% of a photopolymerization initiator (b), and 0.01-20.0 mass% of a compound given by the following general formula (I) as a multifunctional polymerizable compound (c). (In general formula (I), R1 and R2 each independently represent at least one selected from the group consisting of a hydrogen atom, C1-6 alkyl groups, C2-6 alkenyl groups, aryl groups, and aralkyl groups, and R3 is at least one polymerizable functional group selected from the group consisting of a (meth)acryloyl group, a 4-vinylphenyl group, and a C2-5 alkenyl groups. n is any integer from 0-5.)
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Inventors:
NOGUCHI DAIKI (JP)
FUKUMOTO TAKASHI (JP)
SUZUKI KENJI (JP)
FUKUMOTO TAKASHI (JP)
SUZUKI KENJI (JP)
Application Number:
PCT/JP2020/025111
Publication Date:
December 30, 2020
Filing Date:
June 25, 2020
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
A61C13/01; A61K6/60; A61K6/62; B29C64/106; B33Y10/00; C08F220/28; C08F290/06; B29K33/04
Domestic Patent References:
| WO2012042911A1 | 2012-04-05 |
Foreign References:
| JP2012097199A | 2012-05-24 | |||
| JP2015010168A | 2015-01-19 | |||
| JP2000159621A | 2000-06-13 |
Other References:
See also references of EP 3991958A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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