Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/044367
Kind Code:
A1
Abstract:
Provided is a curable composition with high practical utility which has favourable workability, is cured by atmospheric moisture or the like, gives hardened material with a high elongation at break, and has outstanding heat resistance and weather resistance. The curable composition contains a vinyl copolymer (A) having a hydrolysable silyl group and a (meth)acrylic copolymer (B) having a hydroxyl group value of 50-300 mgKOH/g and a weight average molecular weight of 1500-6000, wherein the vinyl copolymer (A) having a hydrolysable silyl group is produced by living free radical polymerization, and the content of the aforementioned (meth)acrylic copolymer (B) is 20-200 parts by mass to 100 parts by mass of the aforementioned vinyl copolymer (A).
Inventors:
YONEDA KOTARO (JP)
KAAI MICHIHIRO (JP)
KAAI MICHIHIRO (JP)
Application Number:
PCT/JP2009/067548
Publication Date:
April 22, 2010
Filing Date:
October 08, 2009
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
YONEDA KOTARO (JP)
KAAI MICHIHIRO (JP)
YONEDA KOTARO (JP)
KAAI MICHIHIRO (JP)
International Classes:
C08L43/04; C08F230/08; C08L33/06
Domestic Patent References:
| WO2004069923A1 | 2004-08-19 | |||
| WO2009145245A1 | 2009-12-03 |
Foreign References:
| JP2000178456A | 2000-06-27 | |||
| JP2002129097A | 2002-05-09 | |||
| JP2008239859A | 2008-10-09 |
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