CURABLE HOT-MELT SILICONE COMPOSITION, CURED MATERIAL THEREOF, AND LAMINATE CONTAINING CURABLE HOT-MELT SILICONE COMPOSITION OR CURED MATERIAL THEREOF

Title:

CURABLE HOT-MELT SILICONE COMPOSITION, CURED MATERIAL THEREOF, AND LAMINATE CONTAINING CURABLE HOT-MELT SILICONE COMPOSITION OR CURED MATERIAL THEREOF

Document Type and Number:

WIPO Patent Application WO/2021/132710

Kind Code:

A1

Abstract:

[Problem] To provide a curable hot-melt silicone composition such that curing thereof is difficult to be inhibited, and that is superior in storage stability, and a sheet or a film made from the same. [Solution] A curable hot-melt silicone composition according to the present invention comprises (A) (A1) an organopolysiloxane resin having a cure-reactive functional group including a carbon-carbon double bond, the organopolysiloxane resin including at least 20 mol% of the Q unit; (A2) a solid organopolysiloxane resin having no cure-reactive functional group including a carbon-carbon double bond, the solid organopolysiloxane resin including an organopolysiloxane resin including at least 20 mol% of the Q unit; (B) a chain organopolysiloxane having a cure-reactive functional group including at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxan resin such that the rate of mass loss after exposure at 100°C under atmospheric pressure for one hour with respect to mass loss before the exposure is at most 10 mass%; and (D) a hydrosilylation reaction catalyst. The curable hot-melt silicone composition as a whole has hot-meltability.

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Inventors:

YAMAZAKI RYOSUKE (JP)
OZAKI KOUICHI (JP)
IMAIZUMI TORU (JP)

Application Number:

PCT/JP2020/049074

Publication Date:

July 01, 2021

Filing Date:

December 28, 2020

Export Citation:

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Assignee:

DOW TORAY CO LTD (JP)

International Classes:

C08L83/07; B32B27/00; C08L83/05; C09J7/35; C09J11/06; C09J183/05; C09J183/07; H01L23/29; H01L23/31; H01L33/56

Domestic Patent References:

WO2018030288A1	2018-02-15
WO2016136243A1	2016-09-01

Foreign References:

JP2017512224A	2017-05-18
JPH0625602A	1994-02-01
JP2006274007A	2006-10-12
JP2014009322A	2014-01-20
JP2017512224W
JP2019167832A	2019-10-03
JP2019167833A	2019-10-03

Other References: