Title:
MULTILAYER BODY AND ELECTRONIC COMPONENT FORMED OF SAME
Document Type and Number:
WIPO Patent Application WO/2021/132711
Kind Code:
A1
Abstract:
[Problem] One purpose of the present invention is to provide: a multilayer body which is composed of a base material such as a semiconductor precursor substrate and a flat silicone sealing layer that closely adheres to the base material, while containing no voids and the like; and a multilayer body which has a structure wherein two base materials of a same kind or different kinds are bonded to each other, with a silicone layer being interposed therebetween, said silicone layer containing no voids and the like. Another purpose of the present invention is to provide: a multilayer body wherein a stress is not likely to be applied to a substrate even after the curing of a curable hot melt silicone composition by using a curable hot melt silicone composition layer that has a specific composition; and a low-stress electronic device which is formed of this multilayer body. [Solution] A multilayer body which comprises: a base material; and a curable hot melt silicone composition layer that is in contact with the base material, while containing an organopolysiloxane resin which contains at least 20% by mole of a siloxane unit that is selected from the group consisting of a T unit and a Q unit relative to all siloxane units, and having a melt viscosity of 5,000 Pa∙s or less at 100°C as determined by a flow tester at the pressure of 2.5 MPa.
Inventors:
YAMAMOTO SHINICHI (JP)
YAMAZAKI RYOSUKE (JP)
YOSHIDA SHIN (JP)
YAMAZAKI RYOSUKE (JP)
YOSHIDA SHIN (JP)
Application Number:
PCT/JP2020/049075
Publication Date:
July 01, 2021
Filing Date:
December 28, 2020
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
B32B27/00; C08L83/04; C08L83/05; C08L83/07; H01L23/29; H01L23/31
Domestic Patent References:
| WO2019078140A1 | 2019-04-25 | |||
| WO2019049794A1 | 2019-03-14 | |||
| WO2019049791A1 | 2019-03-14 | |||
| WO2016035285A1 | 2016-03-10 | |||
| WO2018235492A1 | 2018-12-27 | |||
| WO2019049794A1 | 2019-03-14 | |||
| WO2019049791A1 | 2019-03-14 |
Foreign References:
| JP2016124957A | 2016-07-11 | |||
| JP4607429B2 | 2011-01-05 | |||
| JP2014237834A | 2014-12-18 |
Other References:
See also references of EP 4082776A4
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