Title:
CURABLE HOT MELT SILICONE COMPOSITION, CURED PRODUCT OF SAID COMPOSITION, AND METHOD FOR PRODUCING FILM OR THE LIKE COMPRISING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/017746
Kind Code:
A1
Abstract:
[Problem] To provide: a hot melt silicone composition that can be cured at a wide temperature range from low to high temperatures in accordance with a sealing process and the heat resistance of a resin member, can achieve suitable curability at room temperature or other low temperatures in particular, obtains a cured product having excellent transparency and yellowing resistance, and has excellent handling workability in overmolding and the like; and a use for the hot melt silicone composition. [Solution] Provided is a curable hot melt silicone composition containing: (A) a resin/linear structure–containing organopolysiloxane block copolymer having a chain organosiloxane block Y and a resinous organosiloxane block X that includes a Q unit and a triorganosiloxane unit (MRA unit) which has a silicon atom–bonded functional group (RA) including an acrylic group or a methacrylic group, the block copolymer having at least two of said silicon atom–bonded functional group (RA) per molecule; and (B) a radical polymerization initiator. Also provided is a use for the curable hot melt silicone composition.
Inventors:
YOKOUCHI YUKI (JP)
IIMURA TOMOHIRO (JP)
FURUKAWA HARUHIKO (JP)
IIMURA TOMOHIRO (JP)
FURUKAWA HARUHIKO (JP)
Application Number:
PCT/JP2022/029267
Publication Date:
February 16, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08F299/08; B32B27/00; C08L83/04; C08L83/10; H01L23/29; H01L23/31
Domestic Patent References:
| WO2016136243A1 | 2016-09-01 | |||
| WO2020026748A1 | 2020-02-06 |
Foreign References:
| JP2001131417A | 2001-05-15 |
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