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Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION, THERMALLY CONDUCTIVE MEMBER, AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/215510
Kind Code:
A1
Abstract:
[Problem] To provide: a curable organopolysiloxane composition that yields an organopolysiloxane cured product in which changes in the hardness of the cured product are suppressed even after heat aging while the cured product has high thermal conductivity, and in which it is possible to maintain flexibility and stress relaxation characteristics even when a thermally conductive member composed of the cured product is used under high temperature; a thermally conductive member composed of the curable organopolysiloxane composition; and a heat dissipation structure using the same. [Solution] Provided is a curable organopolysiloxane composition containing: (A) an alkenyl-group-containing organopolysiloxane having a specific viscosity; (B) an organohydrogen polysiloxane; (C) a thermally conductive filler in an amount ranging from 60 to 90 vol% of the total solids fraction in the composition; (D) at least one selected from fatty acids, fatty acid esters, and fatty acid metal salts in an amount ranging from 0.05 to 2.00 parts by mass per 100 parts by mass of component (C); (E) a catalytic amount of a catalyst for a hydrosilylation reaction; and (F) a heat-resistance-imparting agent. Also provided is a use of the curable organopolysiloxane composition.

Inventors:
OTA KENJI (JP)
Application Number:
PCT/JP2022/013226
Publication Date:
October 13, 2022
Filing Date:
March 22, 2022
Export Citation:
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Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08K5/09; C08K5/10; C08K5/3415; C08K5/5415; C08L83/05; C08L83/07
Domestic Patent References:
WO2013051600A12013-04-11
WO2020203299A12020-10-08
WO2019021826A12019-01-31
WO2011007789A12011-01-20
Foreign References:
JPH07330927A1995-12-19
JP2002080816A2002-03-22
JP2002088227A2002-03-27
JP2014503680W
JPS528854B21977-03-11
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