Title:
CURABLE RESIN COMPOSITION, COATING LAYER, AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/054563
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin composition which has excellent adhesiveness and is capable of forming a cured product having excellent hardness. In addition, the purpose of the present invention is to provide a coating layer and a film formed using said curable resin composition. The present invention provides a curable composition containing a curable resin and a photoinitiator, wherein the curable resin includes a polysilsesquioxane having a cationically polymerizable group, an alicyclic epoxy compound, and a compound having a hydrogen-bonding functional group and a cationically polymerizable group and having a hydrogen-bonding functional group value of at least 1.0×10-3 mol/g.
Inventors:
UCHINO SHINYA (JP)
Application Number:
PCT/JP2022/036380
Publication Date:
April 06, 2023
Filing Date:
September 29, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08G59/14; C08K5/1515
Domestic Patent References:
| WO2018037565A1 | 2018-03-01 | |||
| WO2018189945A1 | 2018-10-18 | |||
| WO2016203957A1 | 2016-12-22 | |||
| WO2016204115A1 | 2016-12-22 |
Foreign References:
| JP2018111786A | 2018-07-19 | |||
| US20110124764A1 | 2011-05-26 | |||
| JP2018177952A | 2018-11-15 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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