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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, AND COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/082322
Kind Code:
A1
Abstract:
A curable resin composition, and a composite material and a preparation method therefor. A curing reaction of the curable resin composition is not only a reaction of a curing agent and an epoxy functional group, but also a composite reaction of a plurality of reactions. Moreover, the curable resin composition also has latency and can be used for preparing a composite material prepreg and a single-component adhesive.

Inventors:
LIU WEI (CN)
Application Number:
PCT/CN2021/132257
Publication Date:
May 19, 2023
Filing Date:
November 23, 2021
Export Citation:
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Assignee:
CHANGZHOU BAMSTONE COMPOSITES CO LTD (CN)
International Classes:
C08G59/40; C08G59/14; C08G59/20; C08L63/00; C08L63/04
Foreign References:
CN105566854A2016-05-11
CN103865035A2014-06-18
CN107922576A2018-04-17
JP2017071706A2017-04-13
Attorney, Agent or Firm:
SU ZHOU ZHONG HE INTELLECTUAL PROPERTY FIRM (CN)
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