Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/195993
Kind Code:
A1
Abstract:
The present invention provides: a curable resin composition having at least one polymer precursor selected from the group comprising a polyimide precursor and a polybenzoxazole precursor, and a hydrogen bonding nitrogen atom, and including a polymer compound having a group including two or more ethylene unsaturated groups, wherein the radical polymer group value derived from a compound which has a radical polymer group that has a molecular weight of 2,000 or less relative to the total solid component of the composition is 0.25-4.35 mmol/g; a cured film obtained by curing the curable resin composition; a laminate including the cured film; a method for manufacturing the cured film; and a semiconductor device including the cured film or the laminate.
Inventors:
INOUE HARUNA (JP)
AOSHIMA TOSHIHIDE (JP)
AOSHIMA TOSHIHIDE (JP)
Application Number:
PCT/JP2020/011327
Publication Date:
October 01, 2020
Filing Date:
March 16, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F283/04; B32B15/088; C08F2/44; C08F290/14; C08G73/10; C08G73/22; G03F7/004; G03F7/027; G03F7/037; G03F7/20; G03F7/40
Domestic Patent References:
| WO2017002858A1 | 2017-01-05 |
Foreign References:
| JPH11282155A | 1999-10-15 | |||
| JP2010266814A | 2010-11-25 | |||
| JP2002212192A | 2002-07-31 | |||
| JP2009109987A | 2009-05-21 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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