Title:
PATTERN FORMING COMPOSITION, KIT, PATTERN MANUFACTURING METHOD, PATTERN, AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/195994
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a pattern forming composition that has a suppressed effect on metals and that has excellent temporal stability with respect to imprints on which molds are repeatedly used. This pattern forming composition contains a polymerizable compound, a photoinitiator, and an organic halogen compound including at least one atom selected from the group consisting of chlorine, bromine, and iodine atoms. The organic halogen compound is a compound stable against light from a mercury lamp. The contained amount of the organic halogen compound with respect to the total solid content in the pattern forming composition is 0.001-1.0 mass%.
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Inventors:
GOTO YUICHIRO (JP)
SHIMOJU NAOYA (JP)
SHIMOJU NAOYA (JP)
Application Number:
PCT/JP2020/011328
Publication Date:
October 01, 2020
Filing Date:
March 16, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F20/10; B29C59/02; H01L21/027
Domestic Patent References:
| WO2013154112A1 | 2013-10-17 |
Foreign References:
| JP2007069301A | 2007-03-22 | |||
| JP2015112781A | 2015-06-22 | |||
| JP2017073512A | 2017-04-13 | |||
| JP2011187824A | 2011-09-22 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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