Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/196363
Kind Code:
A1
Abstract:
Provided are: a curable resin composition that contains at least one type of polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, and a compound represented by formula (1-1); a cured film obtained by curing the curable resin composition; a layered product containing the cured film; a method for producing the cured film; and a semiconductor device containing the cured film or the layered product. In formula (1-1), X1 denotes -O- or -S-, L1 denotes a divalent linking group having a formula weight of 1000 or less, R1 and R2 each independently denote a monovalent organic group, and R1 and at least one of R2 and L contain an ethylenically unsaturated group.
Inventors:
AOSHIMA TOSHIHIDE (JP)
Application Number:
PCT/JP2020/012594
Publication Date:
October 01, 2020
Filing Date:
March 23, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/34; B32B15/08; C08F2/44; C08F2/50; C08F20/36; C08F283/00; C08F290/14; G03F7/027; G03F7/037; G03F7/095
Domestic Patent References:
| WO2017002858A1 | 2017-01-05 |
Foreign References:
| JP2003301164A | 2003-10-21 | |||
| JP2000515129A | 2000-11-14 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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