Title:
MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2020/196362
Kind Code:
A1
Abstract:
A multilayer body which sequentially comprises a base material, an organic layer, a protective layer and a photosensitive layer in this order, and which is configured such that: the photosensitive layer contains a resin that has a repeating unit having an acid-decomposable group represented by formula (A1); the content of a repeating unit having a polar group in the resin is less than 10% by mass with respect to the total mass of the resin; the photosensitive layer is subjected to a development process that uses a developer liquid; and the protective layer is subjected to a removal process that uses a remover liquid. A composition that is used for the formation of a protective layer or a photosensitive layer, which is contained in the above-described multilayer body; and a kit for forming a multilayer body, which is used for the formation of the above-described multilayer body.
Inventors:
NAKAMURA ATSUSHI (JP)
TAKAKUWA HIDEKI (JP)
TAKAKUWA HIDEKI (JP)
Application Number:
PCT/JP2020/012593
Publication Date:
October 01, 2020
Filing Date:
March 23, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F220/30; G03F7/004; G03F7/038; G03F7/039; G03F7/11; G03F7/20; G03F7/26; G03F7/32; G03F7/42
Domestic Patent References:
| WO2015064602A1 | 2015-05-07 | |||
| WO2016208300A1 | 2016-12-29 | |||
| WO2015064605A1 | 2015-05-07 |
Foreign References:
| JP2015129273A | 2015-07-16 | |||
| JP2013050511A | 2013-03-14 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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