Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/226131
Kind Code:
A1
Abstract:
Provided is a curable resin composition comprising: at least one type of polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor; and a compound having, per molecule, two or more aromatic rings to which a vinyl group is directly bonded, and which may be substituted. Also provided are: a cured film formed by curing the curable resin composition; a laminate containing the cured film; a method for manufacturing the cured film; and a semiconductor device containing the cured film or the laminate.
Inventors:
AOSHIMA TOSHIHIDE (JP)
INOUE HARUNA (JP)
SHIBUYA AKINORI (JP)
INOUE HARUNA (JP)
SHIBUYA AKINORI (JP)
Application Number:
PCT/JP2020/018409
Publication Date:
November 12, 2020
Filing Date:
May 01, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/06; C08G73/22; C08L79/04; C08L79/08; G03F7/004; G03F7/027; G03F7/037; G03F7/20; G03F7/40; H01L21/312
Domestic Patent References:
| WO2018225676A1 | 2018-12-13 | |||
| WO2017002353A1 | 2017-01-05 |
Foreign References:
| JP2001189109A | 2001-07-10 | |||
| JP2008122562A | 2008-05-29 | |||
| JP2018016793A | 2018-02-01 | |||
| US20190016874A1 | 2019-01-17 |
Other References:
KATOH,KATOH KOHJI, CHEMICAL HITACHI, MICROSYSTEMS DUPONT, LTDKOHJI: "Latest Technology of Stress Buffer Material for Semiconductor Application", NIPPON GOMU KYOKAISHI, vol. 85, no. 2, 2012, pages 40 - 45, XP055760368
Attorney, Agent or Firm:
SIKs & Co. (JP)
Download PDF: