Title:
CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYER BODY, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/226132
Kind Code:
A1
Abstract:
The present invention provides: a curable resin composition which contains at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, wherein the polymer precursor comprises an aromatic ring to which an optionally substituted vinyl group is directly bonded; a cured film which is obtained by curing the curable resin composition; a multilayer body which contains the cured film; a method for producing the cured film; and a semiconductor device which comprises the cured film or the multilayer body.
Inventors:
AOSHIMA TOSHIHIDE (JP)
Application Number:
PCT/JP2020/018410
Publication Date:
November 12, 2020
Filing Date:
May 01, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/12; C08G73/22; C08L79/04; C08L79/08; G03F7/004; G03F7/027; G03F7/20; G03F7/40; H01L21/312
Domestic Patent References:
| WO2010110335A1 | 2010-09-30 | |||
| WO2006109514A1 | 2006-10-19 | |||
| WO2018225676A1 | 2018-12-13 | |||
| WO2016167038A1 | 2016-10-20 |
Foreign References:
| JP2004055340A | 2004-02-19 | |||
| JP2004051781A | 2004-02-19 | |||
| JP2001189109A | 2001-07-10 | |||
| JPH11193326A | 1999-07-21 | |||
| US5021540A | 1991-06-04 |
Other References:
KATOH KOHJI: "Latest technology of stress buffer material for semiconduct application", NIPPON GOMU KYOKAISHI, 2012, pages 40 - 45
Attorney, Agent or Firm:
SIKs & Co. (JP)
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