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Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYIMIDE OR POLYIMIDE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2020/255859
Kind Code:
A1
Abstract:
A curable resin composition including at least one resin selected from the group consisting of polyimides and polyimide precursors having a polyalkyleneoxy group and a polymerizable group, a polymerization initiator, a polymerizable compound, and a solvent; a cured film obtained by curing the curable resin composition; a laminate including the cured film; a method for producing the cured film; a semiconductor device including the cured film or the laminate; and a polyimide or a polyimide precursor.

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Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2020/023071
Publication Date:
December 24, 2020
Filing Date:
June 11, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; C08K5/00; C08K5/11; C08K5/33; C08L79/08; G03F7/027; G03F7/40
Domestic Patent References:
WO2017002860A12017-01-05
WO2011040399A12011-04-07
Attorney, Agent or Firm:
SIKs & Co. (JP)
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