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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, CURED FILM OBTAINED THEREFROM, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/276911
Kind Code:
A1
Abstract:
A curable resin composition comprising a monomer having one to six (meth)acryl groups in the molecule and a polymer having a (meth)acryl group in the molecule, wherein the total number of (meth)acryl groups in the monomer molecule which are the same as the (meth)acryl group of the polymer is 2 or less.

Inventors:
AWA SHIGEKI (JP)
Application Number:
PCT/JP2022/025437
Publication Date:
January 05, 2023
Filing Date:
June 27, 2022
Export Citation:
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Assignee:
OSAKA ORGANIC CHEMICAL IND LTD (JP)
International Classes:
C08F290/00; B05D7/24; B32B27/30
Domestic Patent References:
WO2022114101A12022-06-02
Foreign References:
JP2000338308A2000-12-08
JP2014118508A2014-06-30
JP2002067238A2002-03-05
JP2013155340A2013-08-15
JP2013155341A2013-08-15
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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