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Title:
CURABLE RESIN COMPOSITION, CURED OBJECT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/241803
Kind Code:
A1
Abstract:
The curable resin composition of the present invention includes a moisture-curable resin (A) and gives cured objects having a 25°C storage modulus of 10 MPa or greater and a 25°C elongation at break of 700% or greater.

Inventors:
HAGIWARA KOUHEI (JP)
YUUKI AKIRA (JP)
TAMAGAWA TOMOKAZU (JP)
KIDA TAKUMI (JP)
JO KON (JP)
Application Number:
PCT/JP2020/021246
Publication Date:
December 03, 2020
Filing Date:
May 28, 2020
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G18/30; C08G18/08; C08L33/04; C08L75/04
Domestic Patent References:
WO2016167305A12016-10-20
Foreign References:
JP2008133460A2008-06-12
JP2008208191A2008-09-11
JP2019199544A2019-11-21
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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