Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE AGENT, AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/090347
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a curable resin composition having excellent heat resistance, thermal conductivity, and adhesiveness, and low linear expansion. Another purpose of the present invention is to provide a cured product of said curable resin composition, as well as an adhesive agent and adhesive film which are obtained by using said curable resin composition. The present invention is a curable resin composition comprising a curable resin and a curing agent. The curing agent contains an imide oligomer having a crosslinkable functional group that can react with the curable resin. Either the imide oligomer is mesogenic, or the curing agent contains, in addition to the imide oligomer, another curing agent that is mesogenic.
Inventors:
WAKIOKA SAYAKA (JP)
OWASHI KEIGO (JP)
HOUJOU KENTAROU (JP)
NAKAMURA YUU (JP)
OWASHI KEIGO (JP)
HOUJOU KENTAROU (JP)
NAKAMURA YUU (JP)
Application Number:
PCT/JP2022/042510
Publication Date:
May 25, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/40; C08G73/10; C09J7/35; C09J11/04; C09J11/06; C09J163/00; C09J201/00
Domestic Patent References:
| WO2018221217A1 | 2018-12-06 | |||
| WO2018139558A1 | 2018-08-02 | |||
| WO2012105558A1 | 2012-08-09 |
Foreign References:
| JPH02191630A | 1990-07-27 | |||
| JP2017149910A | 2017-08-31 | |||
| CN207149306U | 2018-03-27 | |||
| JP2019108517A | 2019-07-04 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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