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Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, PREPREG, CURED PRODUCT OF PREPREG, LAMINATED STRUCTURE, CURABLE RESIN COMPOSITION PRODUCTION METHOD, AND CURED PRODUCT PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/219157
Kind Code:
A1
Abstract:
The present invention pertains to: a curable resin composition which contains an epoxy resin and a modified lignin having undergone chemical modification by polyethylene glycol, and in which the epoxy resin and the modified lignin are in a non-compatible state; a curable resin composition which contains an epoxy resin, a modified lignin having undergone chemical modification by polyethylene glycol, and fibers, and from which a cured product having a void rate of 3% or less is obtained, the cured product being obtained by processing the curable resin composition into a sheet having a thickness of 0.2 mm, obtaining a test piece having a thickness of 1 mm by laminating five of the sheets, and thermally curing the same at a pressure of 0.3 MPa and a temperature of 150°C; and a curable resin composition which contains an epoxy resin, a modified lignin, and a curing agent, and in which the amount of heat generated in association with curing changes over time.

Inventors:
ICHIKAWA DAIKI (JP)
KUNITA MAIKO (JP)
TAYAMA KOSUKE (JP)
MIZUNO YASUKO (JP)
Application Number:
PCT/JP2023/017880
Publication Date:
November 16, 2023
Filing Date:
May 12, 2023
Export Citation:
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Assignee:
SUPER RESIN INC (JP)
International Classes:
C08L63/00; B32B5/24; B32B5/26; C08G59/54; C08H7/00; C08J5/04; C08J5/24; C08K5/21; C08K5/315; C08K7/02; C08L71/02; C08L97/00
Foreign References:
JP2003277615A2003-10-02
JP2018104688A2018-07-05
JP2020203968A2020-12-24
JP2021014125A2021-02-12
JP2017197517A2017-11-02
JPH04106128A1992-04-08
JP2019108490A2019-07-04
CN113717400A2021-11-30
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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