Title:
CURABLE RESIN COMPOSITION, METHOD FOR CURING SAME, AND SHEET MANUFACTURED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2014/021521
Kind Code:
A1
Abstract:
Provided are a curable compound, a photoinitiator, and a curable resin composition comprising at least two thermal initiators having different initiation reaction temperatures. Since the curable resin composition can improve a curing rate while having a high conversion rate, the curable resin composition is suitable for manufacturing thick films.
Inventors:
KIM DONG KWAN (KR)
LEE MIN HEE (KR)
LEE MIN HEE (KR)
Application Number:
PCT/KR2012/011615
Publication Date:
February 06, 2014
Filing Date:
December 27, 2012
Export Citation:
Assignee:
LG HAUSYS LTD (KR)
International Classes:
C08F20/10; C08J5/18; C08J7/04; C08L33/04
Foreign References:
| KR20090132548A | 2009-12-30 | |||
| KR20110011197A | 2011-02-08 | |||
| KR20060020098A | 2006-03-06 | |||
| KR100934342B1 | 2009-12-29 | |||
| JP2010189485A | 2010-09-02 |
Other References:
See also references of EP 2881405A4
Attorney, Agent or Firm:
DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
특허법인 대아 (KR)
특허법인 대아 (KR)
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