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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/241378
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition which enables the achievement of a molded article that has excellent transparency and excellent impact strength. A curable resin composition which contains a styrene monomer and a polycarbonate resin that comprises a terminal structure having an unsaturated group represented by formula (1) and a constituent unit represented by formula (2).

Inventors:
OGAWA NORIYOSHI (JP)
ISHIKAWA SHUN (JP)
Application Number:
PCT/JP2021/019100
Publication Date:
December 02, 2021
Filing Date:
May 20, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F290/06; C08F283/02; C08G64/04; C08G64/22
Domestic Patent References:
WO2021079893A12021-04-29
Foreign References:
JP2001139791A2001-05-22
JPH061813A1994-01-11
JP2005139261A2005-06-02
JPS63159415A1988-07-02
JPH08127667A1996-05-21
JPS4825076B11973-07-26
JP2001139791A2001-05-22
Other References:
See also references of EP 4159778A4
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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