CURABLE RESIN COMPOSITION AND USE THEREFOR

Title:

CURABLE RESIN COMPOSITION AND USE THEREFOR

Document Type and Number:

WIPO Patent Application WO/2023/054479

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a curable resin composition that can provide a cured product having exceptional adhesive strength, rigidity at high temperatures, and vibration damping properties. This problem is solved by a curable resin composition containing: an epoxy resin (A) having a specific composition; polymer particles (B) having specific physical properties; and a latent curing agent (C).

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Inventors:

OKAMOTO TOSHIHIKO (JP)

Application Number:

PCT/JP2022/036198

Publication Date:

April 06, 2023

Filing Date:

September 28, 2022

Export Citation:

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Assignee:

KANEKA CORP (JP)

International Classes:

C08L63/00; B32B27/00; B32B27/38; B62D21/00; C08F265/06; C08F279/02; C08F283/12; C08G59/14; C08G59/40; C08K3/013; C08K3/34; C08K5/315; C08L51/00; C09J11/06; C09J11/08; C09J163/00

Domestic Patent References:

WO2017179536A1	2017-10-19
WO2017099060A1	2017-06-15

Foreign References:

JP2019038926A	2019-03-14
JPH11263865A	1999-09-28

Attorney, Agent or Firm:

HARAKENZO WORLD PATENT & TRADEMARK (JP)

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