Title:
CURABLE RESIN COMPOSITION, VARNISH, PREPREG, CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/026845
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin composition and a prepreg for obtaining a cured product having improved heat resistance. As a means of solution, provided is a curable resin composition containing 100 weight parts of the following component (A) and 0.1-4.9 weight parts of the following component (B). (A): polyphenylene ether resin. (B): diallyl ether compound represented by general formula (1) (in the formula, R1-R8 each independently represent a hydrogen atom or a C1-5 linear or branched alkyl group.)
Inventors:
NASU AKIHITO (JP)
YOSHII TAKERU (JP)
IMAI RYOTA (JP)
WATANABE KENTARO (JP)
YOSHII TAKERU (JP)
IMAI RYOTA (JP)
WATANABE KENTARO (JP)
Application Number:
PCT/JP2022/030353
Publication Date:
March 02, 2023
Filing Date:
August 09, 2022
Export Citation:
Assignee:
HONSHU CHEMICAL IND (JP)
International Classes:
C08L71/12; C08F2/44; C08F283/08; C08J5/24; C08K5/06
Domestic Patent References:
| WO2020256045A1 | 2020-12-24 |
Foreign References:
| JP2014034580A | 2014-02-24 | |||
| JP2008524867A | 2008-07-10 | |||
| JP2007507591A | 2007-03-29 | |||
| CN110938357A | 2020-03-31 | |||
| CN110628310A | 2019-12-31 | |||
| CN109957203A | 2019-07-02 |
Attorney, Agent or Firm:
YAMADA, Yasuyuki et al. (JP)
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