CURABLE RESIN COMPOSITION - THREE BOND CO LTD

Title:

CURABLE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2022/244880

Kind Code:

A1

Abstract:

Provided is a curable resin composition containing the following components (A)-(E). (A) A compound having two or more glycidyl groups per molecule (however, not including (B)). (B) A glycidyl-group-containing acrylic polymer. (C) A tackifier having a phenol skeleton and having an OH value of 100 or greater. (D) An inorganic filler. (E) A curing agent. According to the present invention, there is provided a structural adhesive having high flexibility and exceptional resin strength, adhesive strength, and toughness coefficient.

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Inventors:

OTSUKI NAOYA (JP)

Application Number:

PCT/JP2022/021006

Publication Date:

November 24, 2022

Filing Date:

May 20, 2022

Export Citation:

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Assignee:

THREE BOND CO LTD (JP)

International Classes:

C08L63/00; C08K3/013; C08K3/26; C08K3/34; C08K3/36; C08L63/02; C08L91/00; C09J11/04; C09J11/06; C09J11/08; C09J133/00; C09J163/00; C09J163/02

Domestic Patent References:

WO2020251219A1	2020-12-17
WO2020189579A1	2020-09-24
WO2021024597A1	2021-02-11
WO2021256081A1	2021-12-23

Foreign References:

JP2019123808A	2019-07-25
JP2018197298A	2018-12-13

Attorney, Agent or Firm:

HATTA & ASSOCIATES (JP)

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