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Title:
RESIN COMPOSITION, USE THEREOF, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/244879
Kind Code:
A1
Abstract:
The present invention addresses the problems of: providing a resin composition having excellent low-temperature heat-sealing properties and excellent adhesion to polyolefin resin substrates, as well as a coating agent obtained therefrom; and providing a water dispersion composition, which is a resin composition capable of providing a UD sheet having excellent mechanical properties and excelling in suppression of fluffs, a reinforcing fiber sizing agent comprising the same, a reinforcing fiber bundle, and a UD sheet comprising this reinforcing fiber bundle.　This resin composition contains at least one resin (S) selected from the group consisting of ethylene/α-olefin copolymers (A) that satisfy conditions (a-1) to (a-3) and contain structural units derived from a C3 or higher α-olefin, and acid-modified bodies (B) of the ethylene/α-olefin copolymers (A). (a-1) The kinematic viscosity at 100ºC is 10 to 5,000 mm2/s. (a-2) The content of the structural unit derived from a C3 or higher α-olefin is 60 to 85 mol%. (a-3) The molecular weight distribution (Mw/Mn) is 2.5 or less.

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Inventors:
TATEMATSU RYO (JP)
SUZUKI TERUFUMI (JP)
ABE SHOTA (JP)
YOSHIDA YUTO (JP)
KAWABE KUNIAKI (JP)
Application Number:
PCT/JP2022/021003
Publication Date:
November 24, 2022
Filing Date:
May 20, 2022
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08F8/46; C08F4/6592; C08F10/00; C08L23/00; C09D5/00; C09D5/02; C09D123/00; C09D123/02; C09D123/26; C09J123/00; C09J123/02; C09J123/26; D06M15/227; D06M15/263
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WO2004101679A12004-11-25
WO2010074118A12010-07-01
WO2019044626A12019-03-07
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Other References:
TOSOH RESEARCH TECHNOLOGY REVIEW, vol. 47, 2003, pages 55
"Polymer Analysis Handbook", 2008, ASAKURA PUBLISHING CO., LTD., pages: 184 - 211
J. C. RANDALL, MACROMOLECULES, vol. 15, 1982, pages 353
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OSAWA ET AL., JOURNAL OF THE SOCIETY OF FIBER SCIENCE AND TECHNOLOGY, vol. 33, no. 1, 1977
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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