Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/132317
Kind Code:
A1
Abstract:
Provided is a curable resin composition which has very low CTE and is excellent in terms of heat resistance and crack resistance and of filling property and adhesiveness to copper platings. This curable resin composition comprises (A) epoxy resins, (B) an epoxy resin hardener, and (C) an inorganic filler, wherein the epoxy resins (A) comprise at least three epoxy resins differing in the number of functional groups or in molecular skeletal structure, the three epoxy resins at least including an epoxy resin containing up to two functional groups and an epoxy resin including four or more aromatic rings.
Inventors:
NOGUCHI TOMOTAKA (JP)
KANAZAWA YASUYO (JP)
TAKAHASHI CHIKA (JP)
KANAZAWA YASUYO (JP)
TAKAHASHI CHIKA (JP)
Application Number:
PCT/JP2022/048510
Publication Date:
July 13, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C08K3/013; C08G59/32; C08L63/00; H05K3/42
Domestic Patent References:
| WO2021177089A1 | 2021-09-10 |
Foreign References:
| JP2021531389A | 2021-11-18 | |||
| JP2021512199A | 2021-05-13 | |||
| JP2019038930A | 2019-03-14 | |||
| JP2015007214A | 2015-01-15 | |||
| JP2019052278A | 2019-04-04 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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