Title:
RESIN FILM, LAMINATE, AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/132316
Kind Code:
A1
Abstract:
According to the present invention, a resin film forms a laminate for a package through a gas barrier layer which has a gas barrier property being laminated thereon. The resin film includes polyethylene terephthalate. In a cross section of the resin film, the softening temperature in the flow direction of the resin film and the softening temperature in the width direction of the resin film measured via local thermal analysis are included in the range of 200°C or greater and 254°C or less.
Inventors:
FURUTA KAORU (JP)
TOKINOYA OSAMU (JP)
YAMADA MIKINORI (JP)
TOKINOYA OSAMU (JP)
YAMADA MIKINORI (JP)
Application Number:
PCT/JP2022/048491
Publication Date:
July 13, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
B32B9/00; B32B7/027; B32B27/36; B65D65/40
Foreign References:
| JP2019155646A | 2019-09-19 | |||
| JP2019006082A | 2019-01-17 | |||
| JP2021024112A | 2021-02-22 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
Download PDF: