Title:
CURABLE SILICONE COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2022/030120
Kind Code:
A1
Abstract:
[Problem] The present invention relates to: a curable silicone composition which is able to be configured to contain less or no solvent, and exhibits excellent transparency and excellent adhesion to a base material, while enabling the achievement of a low total haze value; and a cured product of this curable silicone composition. [Solution] A curable silicone composition which contains (A) 100 parts by mass of a chain organopolysiloxane that has an aliphatic unsaturated carbon-carbon bond-containing group, while having a siloxane polymerization degree within the range of from 10 to 1,000, (B) from 1 to 100 parts by mass of a chain organopolysiloxane that has an aliphatic unsaturated carbon-carbon bond-containing group, while having a siloxane polymerization degree within the range of from 1,001 to 10,000, (C) from 0 to 100 parts by mass of an organopolysiloxane resin that contains an M unit and a Q unit, (D) a polyorganohydrogen siloxane, and (E) a catalytic amount of a hydrosilylation catalyst, and which also contains (F) from 0 to 60 parts by mass of an organic solvent relative to a total of 100 parts by mass of the components (A) to (D); and a cured product of this curable silicone composition.
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Inventors:
IIMURA TOMOHIRO (JP)
HINO TAKAKAZU (JP)
FURUKAWA HARUHIKO (JP)
HINO TAKAKAZU (JP)
FURUKAWA HARUHIKO (JP)
Application Number:
PCT/JP2021/023401
Publication Date:
February 10, 2022
Filing Date:
June 21, 2021
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/04; C08L83/05; C08L83/07
Domestic Patent References:
| WO2019003995A1 | 2019-01-03 | |||
| WO2019009175A1 | 2019-01-10 |
Foreign References:
| JP2011026582A | 2011-02-10 | |||
| JPH09141107A | 1997-06-03 | |||
| JP4678471B2 | 2011-04-27 | |||
| JPS5338626B2 | 1978-10-17 | |||
| JP2014047310A | 2014-03-17 | |||
| JP2007308542A | 2007-11-29 |
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