Title:
CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/138336
Kind Code:
A1
Abstract:
[Problem] To provide a hot-melt curable silicone composition and applications therefor, said hot-melt curable silicone composition having excellent hot dispensing properties and storage stability, and being curable with an external energy stimulus as a trigger, and cured products thereof having excellent adhesiveness and mechanical properties. [Solution] A curable silicone composition, a cured product thereof, and use thereof in semiconductor applications, etc., the curable silicone composition including, in specific mass% ranges: (A) a non-hot-melt solid organopolysiloxane resin mixture; (B) a linear organopolysiloxane which has a curing-reactive functional group and is liquid at 25℃; (C) an organohydrogen polysiloxane; and (D) a hydrosilylation reaction catalyst that is inactive at room temperature but is provided with properties that are activated by an energy stimulus from an external source. The curable silicone composition has, as a whole, hot-melt properties and a melt viscosity at 100°C (as measured by a flow tester) of 50 Pa·s or less. In particular, the curable silicone composition of the present invention is suited for use as an adhesive agent/sealing agent in hot dispensing applications.
Inventors:
YAMAZAKI RYOSUKE (JP)
YAMAMOTO SHINICHI (JP)
OZAKI KOUICHI (JP)
IMAIZUMI TORU (JP)
YAMAMOTO SHINICHI (JP)
OZAKI KOUICHI (JP)
IMAIZUMI TORU (JP)
Application Number:
PCT/JP2021/046093
Publication Date:
June 30, 2022
Filing Date:
December 14, 2021
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/07; B32B27/00; C09J11/06; C09J183/07
Domestic Patent References:
| WO2020090797A1 | 2020-05-07 | |||
| WO2019088067A1 | 2019-05-09 | |||
| WO2019078140A1 | 2019-04-25 | |||
| WO2020203307A1 | 2020-10-08 | |||
| WO2020138409A1 | 2020-07-02 | |||
| WO2016136243A1 | 2016-09-01 |
Foreign References:
| JP2014009322A | 2014-01-20 | |||
| JP2017512224W | ||||
| JP2020012027A | 2020-01-23 | |||
| JPS528854B2 | 1977-03-11 | |||
| JPH10195085A | 1998-07-28 |
Other References:
"DOWSILTM EA-4600 Silicone Adhesive Application Guide for PCB Device Assemblies", 2020, DOW TORAY INDUSTRIES, INC.
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